Semiconductor device and a method for securing the device in...

Details Semiconductor device and a method for securing the device in... Semiconductor device and a method for securing the device in...

2006-06-13

2006-06-13

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

C257S702000, C257S696000, C257S787000

Reexamination Certificate

active

07061108

ABSTRACT:
A method for packing a semiconductor device301in a carrier tape406without damage to the leads302includes an interlocking mechanism between the molded semiconductor device with indentations305formed into the package body, and the carrier tape having mating protrusions407slightly smaller than the indentations which cause the device to be held securely without significant movement after a cover tape409is adhered to the carrier tape. The features of correctly sized pockets and pedestals, the cover tape, and the interlocking device indentations and tape protrusions prevent damage to the device leads as a result of impact.

REFERENCES:
patent: 4918513 (1990-04-01), Kurose et al.
patent: 5371408 (1994-12-01), Moulton et al.
patent: 5396988 (1995-03-01), Skrtic
patent: 6525405 (2003-02-01), Chun et al.

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