Semiconductor device and a method for fabricating a...

Details Semiconductor device and a method for fabricating a... Semiconductor device and a method for fabricating a...

2006-04-11

2006-04-11

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S260000, C361S746000, C361S762000

Reexamination Certificate

active

07026547

ABSTRACT:
A semiconductor device (10) includes a semiconductor component integrated in a semiconductor substrate and a conductive pad (110) arranged on top of the semiconductor device (10). The conductive pad is electrically connected with the semiconductor component. The pad is arranged for connecting the semiconductor device (10) externally. A dielectric material (310) is positioned between the conductive pad (110) and a buried conductive layer (20) of the semiconductor device. The dielectric material (310) comprises a stress blocking structure.

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patent: 6617510 (2003-09-01), Schreiber et al.
patent: 6861587 (2005-03-01), SelVakumar et al.

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