Semiconductor device and a manufacturing method thereof

Details Semiconductor device and a manufacturing method thereof Semiconductor device and a manufacturing method thereof

1997-07-11

1999-07-20

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438107, 438108, 438118, H01L 2144, H01L 2148, H01L 2150

Patent

active

059266945

ABSTRACT:
A manufacturing method of a semiconductor device for mounting an LSI bare-chip component, or a bare chip, on a printed circuit board, or a substrate, with flip-chip bonding technology, that includes a recess forming step of forming recesses on substrate pads of the substrate, an adhesive coating step of applying adhesive to a location on the substrate at which the bare chip is to be placed, a chip mounting step of placing the bare chip on the substrate while aligning positions of the bumps formed on the chip pads of the bare chip and the substrate pads of the substrate, and an adhesive hardening step of hardening the applied adhesive.

REFERENCES:
patent: 4816426 (1989-03-01), Bridges et al.
patent: 5523586 (1996-06-01), Sakurai
patent: 5661088 (1997-08-01), Tessier et al.
ICEMM Proceedings '93, Flip Chip Mounting Using Stud Bumps and Adhesives for Encapsulation, T. Kusagaya, et al., pp. 238-246.

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