Semiconductor device and a manufacturing method of the same

Details Semiconductor device and a manufacturing method of the same Semiconductor device and a manufacturing method of the same

2006-09-14

2010-02-02

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S678000, C257S692000, C257S734000, C257SE23043

Reexamination Certificate

active

07656019

ABSTRACT:
A semiconductor device is disclosed wherein first wiring lines in a first row extend respectively from first connecting portions toward one side of a semiconductor chip, while second wiring lines extend respectively from second connecting portions toward the side opposite to the one side of the semiconductor chip. The reduction in size of the semiconductor device can be attained.

REFERENCES:
patent: 2003/0011038 (2003-01-01), Kida
patent: 2003/0218245 (2003-11-01), Matsuzawa et al.
patent: 2004/0164385 (2004-08-01), Kado et al.
patent: 2004/0207067 (2004-10-01), Ma
patent: 6-34983 (1994-02-01), None
patent: 2001-144214 (2001-05-01), None
patent: 2003-31610 (2003-01-01), None

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