Semiconductor device and a lamination and fixing material used i

Details Semiconductor device and a lamination and fixing material used i Semiconductor device and a lamination and fixing material used i

1997-05-15

2000-09-12

Lorin, Francis J.

Stock material or miscellaneous articles

Nonparticulate element embedded or inlaid in substrate and...

257678, 257729, 428 421, 428209, B32B 310, H01L 23544

Patent

active

061175137

ABSTRACT:
A method of manufacturing a semiconductor and a lamination therefor, in which fixing materials are temporarily fixed to the molding faces of a mold through release films. The semiconductor element is then placed in the mold and molding resin is injected into the mold. The resin is heated to produce the semiconductor device. During this process, the fixing materials become embedded in each of the opposite surfaces of the resin.

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