Semiconductor device affixed to an upper and a lower leadframe

Details Semiconductor device affixed to an upper and a lower leadframe Semiconductor device affixed to an upper and a lower leadframe

1996-08-13

1997-06-10

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257672, 257787, H01L 2348, H01L 2350, H01L 2328

Patent

active

056379153

ABSTRACT:
A semiconductor device includes a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semiconductor chip, lower leads electrically coupled to the semiconductor chip, where a second gap is formed between the lower leads and the bottom surface of the semiconductor chip, and an encapsulating resin which encapsulates the semiconductor chip so as to maintain the first and second gaps.

REFERENCES:
patent: 4234666 (1980-11-01), Gursky
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5108955 (1992-04-01), Ishida et al.
patent: 5172214 (1992-12-01), Casto
patent: 5237202 (1993-08-01), Shimizu et al.
patent: 5334872 (1994-08-01), Ueda et al.
Patent Abstracts of Japan, vol. 8, No. 173 (E-259)[610], Aug. 9, 1984 & JP-A-59-066157, Apr. 14, 1984.
Patent Abstracts of Japan, vol. 11, No. 59 (E-482)[2506], Feb. 24, 1987 & JP-A-61-218139, Sep. 27, 1986.

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