Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2008-06-05
2010-06-01
Cao, Phat X (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S728000
Reexamination Certificate
active
07728416
ABSTRACT:
A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.
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Hata Toshiyuki
Otani Takeshi
Satou Yukihiro
Shimizu Ichio
Takahashi Hiroyuki
Cao Phat X
Mattingly & Malur, P.C.
Renesas Technology Corp.
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