Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Reexamination Certificate
2006-01-31
2006-01-31
Lee, Eddie (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Beam leads
C257S666000, C257S667000
Reexamination Certificate
active
06992385
ABSTRACT:
A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.
REFERENCES:
patent: 6777800 (2004-08-01), Madrid et al.
patent: 2003/0122232 (2003-07-01), Hirano et al.
patent: 11-019431 (1999-01-01), None
Hata Toshiyuki
Otani Takeshi
Satou Yukihiro
Shimizu Ichio
Takahashi Hiroyuki
Lee Eddie
Mattingly ,Stanger ,Malur & Brundidge, P.C.
Owens Douglas W.
LandOfFree
Semiconductor device, a method of manufacturing the same and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device, a method of manufacturing the same and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device, a method of manufacturing the same and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3581330