Semiconductor device, a method of manufacturing the same and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads

Reexamination Certificate

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C257S666000, C257S667000

Reexamination Certificate

active

06992385

ABSTRACT:
A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.

REFERENCES:
patent: 6777800 (2004-08-01), Madrid et al.
patent: 2003/0122232 (2003-07-01), Hirano et al.
patent: 11-019431 (1999-01-01), None

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