Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2008-01-29
2008-01-29
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257SE23021, C257S778000, C257S780000, C257S787000, C438S064000, C438S065000, C438S118000, C029S842000, C029S846000
Reexamination Certificate
active
07323779
ABSTRACT:
A semiconductor device includes a semiconductor chip. A stepped member having stepped regions is provided on the semiconductor chip. The stepped member, together with a redistribution layer, is encapsulated by an encapsulating resin layer. The stepped member is exemplified by functional bumps and dummy bumps having stepped regions. The dummy bumps are electrically unconnected to the exterior, but are electrically connected to the redistribution layer.
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Chu Chris C.
OKI Electric Industry Co., Ltd.
Parker Kenneth
Rabin & Berdo PC
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