Semiconductor device

Details Semiconductor device Semiconductor device

2008-03-11

2008-03-11

Luu, Chuong A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S281000, C257S183000, C257S666000, C257S723000

Reexamination Certificate

active

07342307

ABSTRACT:
A semiconductor device includes: a package; two semiconductor chip fixing parts located adjacently to each other in the package; and first and the second semiconductor chips, each of which is fixed on the semiconductor chip fixing part and has a field effect transistor formed therein. A gate lead G1, a source lead S1, and a drain lead D2are arranged from left to right on the first surface of the package and a drain lead D1, a source lead S2, and a gate lead G2are arranged from left to right on the second surface. A gap between the source lead S1and the drain lead D2is two times a gap between the gate lead G1and the source lead S1, and a gap between the drain lead D1and the source lead S2is two times a gap between the source lead S2and the gate lead G2.

REFERENCES:
patent: 3916217 (1975-10-01), Shimada et al.
patent: 3983543 (1976-09-01), Cordaro
patent: 6362509 (2002-03-01), Hart
patent: 6677669 (2004-01-01), Standing
patent: 6928512 (2005-08-01), Ayukawa et al.
patent: 2000-217416 (2000-08-01), None

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