Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-03-29
2011-03-29
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S118000, C438S125000, C438S455000, C438S460000, C438S465000, C257SE21499, C257SE21505, C257SE23018, C257SE31011
Reexamination Certificate
active
07915082
ABSTRACT:
A method of fabricating a semiconductor device includes depositing a mask of low melting point material on a surface of the semiconductor device; depositing a layer to be structured relative to the mask; and removing the mask of low melting point material.
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Beer Gottfried
Mengel Manfred
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
Lebentritt Michael S
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