Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2008-07-08
2008-07-08
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S685000, C257S723000, C257S778000, C257S787000, C257SE21503, C257SE21511
Reexamination Certificate
active
07397132
ABSTRACT:
Disclosed is a semiconductor device including an organic material substrate, a semiconductor chip flip chip connected to substantially a center of one surface of the organic material substrate, and a semiconductor package mounted on another surface of the organic material substrate in a manner to avoid a position opposing to the flip chip connected semiconductor chip. Additionally, disclosed is a semiconductor device including an organic material substrate, a semiconductor chip flip chip connected to substantially a center of one surface of the organic material substrate, and a semiconductor package having a connection terminal and mounted on another surface of the organic material substrate via the connection terminal in a manner that an overlap with the flip chip connected semiconductor chip occurs, at least a part of the connection terminal in the overlap being a dummy terminal not used for transmission of an electric signal.
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Clark Jasmine J
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
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