Semiconductor device

Details Semiconductor device Semiconductor device

2008-04-01

2008-04-01

Duverne, J. F. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

07351068

ABSTRACT:
A semiconductor device includes a first plate member having a circuit surface on which a circuit is provided, a second plate member having a circuit surface on which a circuit is provided, a plurality of first flat plates disposed on the circuit surface of the first plate member, a first communicating section disposed on the circuit surface of the first plate member, a plurality of second flat plates disposed on the circuit surface of the second plate member, and a second communicating section disposed on the circuit surface of the second plate member. The first plate member and the second plate member are arranged so that a surface of the first plate member opposite to the circuit surface faces a surface of the second plate member opposite to the circuit surface.

REFERENCES:
patent: 7173442 (2007-02-01), Treibergs et al.
patent: 7182606 (2007-02-01), Ishii et al.
patent: 7214887 (2007-05-01), Higashida et al.
patent: 7248036 (2007-07-01), Trobough et al.

Affiliated with

Also associated with

Rating

Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2755115