Semiconductor device

Details Semiconductor device Semiconductor device

2011-08-02

2011-08-02

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S673000, C257S692000, C257S693000, C257S773000, C257S777000, C257SE23031, C257SE23043, C257SE23048, C257SE23141, C257SE23170, C257SE23171, C257SE23011, C257SE23039

Reexamination Certificate

active

07989932

ABSTRACT:
A semiconductor device includes a lead frame including inner lead portion having inner leads connected to outer leads and relay inner leads not connected to the outer leads. A semiconductor element is mounted on a lower surface of the lead frame. Electrode pads of the semiconductor element are connected to the inner lead portion via metal wire. One end of the relay inner lead is connected to the electrode pad via the metal wire, and the other end is connected to the outer lead via a relay metal wire disposed to step over the inner lead.

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