Semiconductor device

Details Semiconductor device Semiconductor device

2011-03-29

2011-03-29

Lee, Calvin (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

C438S123000

Reexamination Certificate

active

07915719

ABSTRACT:
A semiconductor device comprises: a first and second die pads arranged side by side; a plurality of inner leads arranged around the first and second die pads; first and second chips mounted on the first and second die pads; a bar provided between the first and second chips and the plurality of inner leads, extending in an array direction of the first chip and the second chip; a plurality of wires that connect the first and second chips and the plurality of inner leads and connect the first chip and the second chip; and resin that seals the first and second die pads, the plurality of inner leads, the first and second chips, the plurality of wires and the bar, wherein the bar comprises a mark provided at a position corresponding to an area between the first chip and the second chip in an array direction of the first chip and the second chip.

REFERENCES:
patent: 6507098 (2003-01-01), Lo et al.
patent: 6841870 (2005-01-01), Misumi
patent: 6867507 (2005-03-01), Uebayashi et al.
patent: 2003-110082 (2003-04-01), None
patent: 2007-035853 (2007-02-01), None

Affiliated with

Also associated with

Rating

Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2690471