Semiconductor device

Details Semiconductor device Semiconductor device

1976-12-09

1978-01-03

Wojciechowicz, Edward J.

357 68, 357 80, H01L 2348, H01L 2302, H01L 3902

Patent

active

040670406

ABSTRACT:
A semiconductor device, which provides efficient heat dissipation, includes a semiconductor support member formed of an insulating, thermally conductive material having a projecting portion on the top surface and a first conducting layer extending along the surfaces of the support members from the bottom to the projecting portion. An insulating wall member for installing terminals is disposed on the top surface of the semiconductor support member in areas around the projecting portion. A second conducting layer is formed on the top end face of the wall member, and a hollow portion is provided in the wall member below the second conducting layer.

REFERENCES:
patent: 3641398 (1972-02-01), Fitzgerald

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