Semiconductor device

Details Semiconductor device Semiconductor device

2011-07-19

2011-07-19

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S684000, C257S738000, C257S780000

Reexamination Certificate

active

07982301

ABSTRACT:
A miniaturized semiconductor device has a package substrate, a semiconductor chip mounted on the main surface of the package substrate and having plural LNAs each for amplifying a signal, an RF VCO for converting the frequency of the signal supplied from each LNA, and an IF VCO for converting the frequency of a signal supplied from a baseband. A plurality of ball electrodes are provided on the back surface of the package substrate. The package substrate is provided with a first common GND wire for supplying a GND potential to each of the LNAs, with a second common GND wire for supplying the GND potential to the RF VCO, and with a third common GND wire for supplying the GND potential to the IF VCO. The first, second, and third common GND wires are separated from each other.

REFERENCES:
patent: 6384701 (2002-05-01), Yamada et al.
patent: 6483175 (2002-11-01), Yoshida
patent: 6580163 (2003-06-01), Poulin
patent: 6770963 (2004-08-01), Wu
patent: 6847108 (2005-01-01), Takikawa et al.
patent: 6937458 (2005-08-01), Seshan
patent: 7020444 (2006-03-01), Shinbo et al.
patent: 2005/0161798 (2005-07-01), Ninomiya et al.
patent: 11-312776 (1999-11-01), None

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