Semiconductor device

Details Semiconductor device Semiconductor device

2011-07-19

2011-07-19

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE21499, C257SE21001, C257SE23031, C438S121000, C438S123000

Reexamination Certificate

active

07982292

ABSTRACT:
A semiconductor device includes a carrier, a chip coupled to the carrier, a dielectric layer coupled to the carrier and the chip, and conducting elements connected to both the carrier and contacts of the chip. The chip includes a first face with a first contact spaced apart from a second contact. The dielectric layer includes a photoinitiator that configures the dielectric layer to be selectively opened to expose the first and second contacts and the carrier. A first conducting element is connected to the first contact, a second conducting element is connected to the second contact, and a third conducting element is connected to the carrier.

REFERENCES:
patent: 5637922 (1997-06-01), Fillion et al.
patent: 7492043 (2009-02-01), Choi et al.
patent: 7524775 (2009-04-01), Ewe et al.
patent: 2002/0094491 (2002-07-01), Kresge et al.
patent: 2007/0126129 (2007-06-01), Ahn et al.
patent: 01/75961 (2001-10-01), None
patent: 2004/077548 (2004-09-01), None

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