Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257SE23020, C228S180500, C174S263000

Reexamination Certificate

active

07911061

ABSTRACT:
A semiconductor device includes a carrier, a chip including a first face having a contact area, where the chip is attached to the carrier such that the contact area faces away from the carrier, a copper connector configured for attachment to the contact area, and a solder material configured to couple the copper connector to the contact area.

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Quirk et al., Semiconductor Manufacturing Technology, Prentice Hall, 2001, pp. 214-221.
Quirk et al., Semiconductor Manufacturing Technology, Prentice Hall, 2001, pp. 571-578.
Silvana Andrea Sommadossi, Investigation on Diffusion Soldering in Cu/In/Cu and Cu/In-48Sn/Cu Systems, Dissertation an der Universitat Stuttgart, Bericht Nr. 125, Jul. 2002, 13 pages.

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