1990-09-04
1991-10-08
James, Andrew J.
357 80, 357 68, 357 65, H01L 2302, H01L 2312
Patent
active
050559125
ABSTRACT:
A semiconductor device mounted on a substrate. Outer leads, partially resin-molded, have a greater height above the mounting surface than that of a conventional device. Specifically, each lead projecting from the molded resin has a bent portion which is convex in the direction opposite to the mounting surface, and the length of the lead beyond the bent portion is greater than the distance from the lead portion adjacent to the resin portion of the lead to the mounting surface. The long leads improve reliability during, e.g., heat cycle, tests. In another embodiment, outer leads, partially resin-molded, have reverse J-shaped bent portions, each with a distal end positioned away from the resin. When the bent portions serve as soldering portions, the soldering condition can be easily checked.
Murasawa Yasuhiro
Sawano Hiroshi
Toda Hitoshi
Yagoura Hideya
Davenport T.
James Andrew J.
Mitsubishi Denki & Kabushiki Kaisha
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