Semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S121000, C438S122000, C257S701000, C257S706000, C257SE23078, C257SE23177

Reexamination Certificate

active

07998797

ABSTRACT:
A method of assembling a semiconductor device includes providing a chip attached to an elastic carrier, and supporting the elastic carrier with a stiffener. The method additionally includes removing the stiffener from the elastic carrier after attaching the elastic carrier to a board.

REFERENCES:
patent: 5724230 (1998-03-01), Poetzinger
patent: 2002/0056570 (2002-05-01), Briar et al.
patent: 2002/0121693 (2002-09-01), Milla et al.
patent: 2006/0001130 (2006-01-01), Islam et al.
patent: 2006/0068576 (2006-03-01), Burdick, Jr. et al.
patent: 2007/0126094 (2007-06-01), Shojaie et al.
patent: 2008/0003780 (2008-01-01), Sun et al.
patent: 2008/0079461 (2008-04-01), Lin et al.
patent: 112200055 (1999-08-01), None
Brunnbauer et al., “Embedded Wafer Level Ball Grid Array (eWLB),” 2006 Electronics Packaging Technology Conference, Copyright 2006, 5 pages.
“Sanmina-Sci Manufacturers World's First Prototype Printed Circuit Board with 100 Percent Embedded ESD Protection,” Sanmina-Sci Press Release, San Jose, CA., Aug. 8, 2007, 3 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2630078

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.