Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2011-08-16
2011-08-16
Clark, Jasmine J (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S121000, C438S122000, C257S701000, C257S706000, C257SE23078, C257SE23177
Reexamination Certificate
active
07998797
ABSTRACT:
A method of assembling a semiconductor device includes providing a chip attached to an elastic carrier, and supporting the elastic carrier with a stiffener. The method additionally includes removing the stiffener from the elastic carrier after attaching the elastic carrier to a board.
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Gruendler Gerold
Hoegerl Juergen
Killer Thomas
Lutz Hermann Josef
Strutz Volker
Clark Jasmine J
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
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