Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2011-06-28
2011-06-28
Parker, Kenneth A (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S686000, C257S700000, C257S723000, C257S782000, C257SE23031, C257SE23037
Reexamination Certificate
active
07968983
ABSTRACT:
Provided is a semiconductor device in which a plurality of chips are packaged without increasing the thickness of the package. A plurality of semiconductor elements (a first and a second semiconductor elements) that are packaged in the semiconductor device are overlaid with each other. Specifically, the first semiconductor element is fixed on the top surface of the first island while the second semiconductor element is fixed on the bottom surface of the second island. Furthermore, each of the islands (a first and a second islands) on which the semiconductor elements are respectively mounted in the present invention provides a structure has an irregular shape, and the islands are overlaid with each other along the sides of the semiconductor element to be mounted.
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Fish & Richardson P.C.
Parker Kenneth A
Sanyo Electric Co,. Ltd.
Sanyo Semiconductor Co. Ltd.
Spalla David
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