Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Details

C257S686000, C257S700000, C257S723000, C257S782000, C257SE23031, C257SE23037

Reexamination Certificate

active

07968983

ABSTRACT:
Provided is a semiconductor device in which a plurality of chips are packaged without increasing the thickness of the package. A plurality of semiconductor elements (a first and a second semiconductor elements) that are packaged in the semiconductor device are overlaid with each other. Specifically, the first semiconductor element is fixed on the top surface of the first island while the second semiconductor element is fixed on the bottom surface of the second island. Furthermore, each of the islands (a first and a second islands) on which the semiconductor elements are respectively mounted in the present invention provides a structure has an irregular shape, and the islands are overlaid with each other along the sides of the semiconductor element to be mounted.

REFERENCES:
patent: 6365979 (2002-04-01), Miyajima
patent: 6603197 (2003-08-01), Yoshida et al.
patent: 6879037 (2005-04-01), Wada et al.
patent: 2002/0121680 (2002-09-01), Ahn et al.
patent: 2007/0096284 (2007-05-01), Wallace
patent: 2007/0102762 (2007-05-01), Matsushima
patent: 2008/0135991 (2008-06-01), Harnden et al.
patent: 1467828 (2004-01-01), None
patent: 1652332 (2005-08-01), None
patent: 2007-05569 (2007-01-01), None

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