Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-06-28
2011-06-28
Arroyo, Teresa M (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S690000, C257S678000, C257SE23070, C257S786000
Reexamination Certificate
active
07968997
ABSTRACT:
A semiconductor device includes a wring board having a first surface with external connection terminals and a second surface with internal connection terminals. On the second surface of the wiring board, a semiconductor chip having electrode pads is mounted. The electrode pads of the semiconductor chip and the internal connection terminals of the wiring board are electrically connected via connecting members. The external connection terminals are arranged along two opposite outer sides of the wiring board and each have a rectangular shape elongated in a direction toward the outer side.
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Arroyo Teresa M
Kabushiki Kaisha Toshiba
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
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