Semiconductor device

Details Semiconductor device Semiconductor device

2011-01-18

2011-01-18

Ha, Nathan W (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE21499

Reexamination Certificate

active

07872348

ABSTRACT:
A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.

REFERENCES:
patent: 7173333 (2007-02-01), Hata et al.
patent: 7173823 (2007-02-01), Rinehart et al.
patent: 2009/0261471 (2009-10-01), Frey
patent: 2010/0084761 (2010-04-01), Shinagawa
patent: 2010/0096743 (2010-04-01), Ganesan et al.
patent: 2010/0127387 (2010-05-01), Soda et al.
patent: 2010/0181665 (2010-07-01), Casey et al.
patent: 9-135565 (1997-05-01), None

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