Semiconductor device

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Patent

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Details

357 72, 357 73, 29577, 204 15, H01L 2934, H01L 2328, H01L 2330, C25D 502

Patent

active

040018717

ABSTRACT:
An integrated circuit device with multi-level interconnection wiring structure built upon the substrate wherein each level is formed of conductor and insulator portions and wherein each level has a surface substantially parallel to the surface of the substrate.

REFERENCES:
patent: 3169892 (1965-02-01), Lemelson
patent: 3320484 (1967-05-01), Riley et al.
patent: 3351825 (1967-11-01), Vidas
patent: 3634203 (1972-01-01), Richardson

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