Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1998-10-06
2000-10-10
Potter, Roy
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438613, H01L 2148
Patent
active
061301124
ABSTRACT:
A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.
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Transaction of the Japan Society of Mechanical Engineers (JSME), vol. 50, No. 505, Chapter A, p. 1709.
Kitano et al., "Thermal Fatique S Strength Estimation of Solder Joints of Surface Mount IC Packages", Soldering & Surface Mount Technology, No. 2, Jun. 1989.
Anjoh Ichiro
Eguchi Shuji
Kitano Makoto
Kohno Ryuji
Kumazawa Tetsuo
Hitachi , Ltd.
Potter Roy
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