Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1997-07-21
1999-04-20
Kincaid, Kristine
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257691, 257693, H01L 2302
Patent
active
058958878
ABSTRACT:
In order to reduce the chip size of a semiconductor device as well as to separate noises between at least two types of pads having different functions, power supply pins and ground pins are provided on opposite edges of a package with input address pins being arranged therebetween and output data pins being arranged outside the same. Control pins and a nonconnected excess pin are arranged in the center. This allows the package to omit wires and reduce chip size.
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Dang-hsing Yiu Tom
Hikawa Tetsuo
Ni Ful-Long
Sawada Takashi
Takata Akira
Dang-hsing Yiu Tom
Kincaid Kristine
Mega Chips Corporation
Ngo Hung V.
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