Semiconductor device

Electrical resistors – Incased – embedded – or housed – Element in insulation with outer metallic sheath

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Details

357 26, 357 68, 338 13, 73DIG4, H01L 2984, H01L 2702, H01L 2348, H01L 2944

Patent

active

044842120

ABSTRACT:
A semiconductor device comprising a semiconductor substrate having at least two resistor elements, wherein said resistor elements have a specific resistance ratio relative to each other, an insulation layer formed on a major surface of said semiconductor substrate, a circuit wiring layer formed on said insulation layer covering a portion of said insulation layer which corresponds to at least one of said resistor elements, and a dummy wiring layer made of the same material as that of the circuit wiring layer and formed on the insulation layer covering that portion of said insulation layer which corresponds to the resistor element or elements not covered by said circuit wiring layer, and where the ratio of an overlapping area of one resistor element in said circuit wiring layer and an overlapping area of the other resistor element and said dummy wiring layer is equal to a resistance ratio of said resistor elements.

REFERENCES:
patent: 4215333 (1980-07-01), Huang
patent: 4398207 (1983-08-01), Hoff, Jr. et al.

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