Semiconductor device

Details Semiconductor device Semiconductor device

1997-09-26

2000-07-18

Trinh, Michael

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257666, 257674, 257676, H01L 2348

Patent

active

060911395

ABSTRACT:
A semiconductor device comprising a package formed of a thermoplastic resin, first and second lead frames arranged parallel to each other with a predetermined space interposed therebetween, and each having a distal end portion of a predetermined length located in the package, solder films formed on the first and second lead frames from outside the package to inside the package, a semiconductor element mounted on the distal end portion of the first lead frame and having an electrode, and a bonding wire having an end connected to the electrode of the semiconductor element, and another end connected to the distal end portion of the second lead frame.

REFERENCES:
patent: 4912544 (1990-03-01), Onuki et al.
patent: 5844308 (1998-12-01), Dedert et al.
patent: 5889317 (1999-03-01), Huang et al.

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