Semiconductor device

Details Semiconductor device Semiconductor device

1990-04-25

1991-08-06

Prenty, Mark

Fishing, trapping, and vermin destroying

357 72, 437209, H01L 2329, H01L 2160

Patent

active

050381962

ABSTRACT:
A material which is rubber-like at room temperature and has excellent heat resistance and whose glass transition temperature is 0.degree. C. or below is used as a die bonding material for securing a semiconductor chip to a lead frame. Since the heat shrinkage of the lead frame is not directly transmitted to the chip, it is possible to obtain a higly reliable semiconductor device which substantially overcomes the problem of chip warpage.

REFERENCES:
patent: 4395527 (1983-07-01), Berger
patent: 4720740 (1988-01-01), Clements

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