Semiconductor device

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Details

357 71, 357 62, H01L 2312, H01L 2314, H01L 2348

Patent

active

050381946

ABSTRACT:
A semiconductor device, which includes: an insulating substrate; a semiconductor element for supplying or cutting off electric power, the element being mounted on the substrate; an electric power terminal mounted on the substrate; a conductivity layer for connecting the semiconductor element and the electric power terminal, the conductivity layer being pattern wired on the substrate by gilding or vapor-plating; and a conductor provided on the conductivity layer.

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patent: 4047197 (1977-09-01), Schierz
patent: 4458305 (1984-07-01), Buckle et al.
patent: 4510677 (1985-04-01), Collumeau
patent: 4514587 (1985-04-01), Van Dyk Soerewyn
patent: 4518982 (1985-05-01), Du Bois et al.
patent: 4538170 (1985-08-01), Yerman
patent: 4556899 (1985-12-01), Kurihara et al.
patent: 4558510 (1985-12-01), Tani et al.

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