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357 54, 357 59, H01L 2934

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active

040140377

ABSTRACT:
A polycrystalline silicon layer as a passivation layer formed on a semiconductor single crystal layer in a semiconductor device and in which polycrystalline silicon layer contains 2 to 45 atomic percent of oxygen. This layer can be formed under accurate control by utilizing a mixed gas of nitrogen oxide as an oxygen supply source and a silicon compound as a silicon supply source is thermally decomposed. The polycrystalline silicon is constituted of grains comprising single crystals of silicon. Oxygen atoms are uniformly distributed in the grains. Substantially no SiO.sub.2 layer exists between the grains and the semiconductor single crystal layer.

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patent: 3878549 (1975-04-01), Yamazaki et al.
W. Steinmaier et al., "Successive Growth of Si and SiO.sub.2 in Epitaxial Apparatus," J. of Electro Chem. Soc., vol. III, No. 2, Feb. 1964, pp. 206-209.

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