Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1995-05-31
1996-09-03
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257753, 257759, 257782, 257783, H01L 2334, H01L 2348, H01L 2352, H01L29;4052
Patent
active
055526373
ABSTRACT:
There is provided a composite semiconductor device having a structure for bonding a wiring board to a package so as to satisfy both of the high thermal conductivity and low elasticity at the same time. The wiring board is fixed on the inner bottom surface of the ceramic package of alumina or the like on which a heat radiating plate is mounted by use of an adhesive agent. A plurality of semiconductor chips such as a CPU and memory are mounted on the wiring board. The chip is fixed on the wiring board by use of an adhesive agent of high thermal conductivity. As most part of the adhesive agent for fixing the wiring board on the package, an adhesive agent of low elasticity is used and an adhesive agent of high thermal conductivity is used in an area below a portion of the wiring board on which the chip is mounted. The stress caused in the interface by a difference between the thermal expansion coefficients of the wiring board and the package when heat is generated from the chip can be efficiently reduced by the adhesive agent of low elasticity since the adhesive agent of high thermal conductivity is applied only in the extremely limited area.
REFERENCES:
patent: 4303934 (0181-12-01), Stitt
patent: 4459607 (1986-07-01), Reid
patent: 4901137 (1990-02-01), Sato et al.
patent: 5199164 (1993-04-01), Kim et al.
Clark Jhihan
Crane Sara W.
Kabushiki Kaisha Toshiba
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