Semiconductor device

Details Semiconductor device Semiconductor device

1993-06-24

1995-02-21

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257776, 257692, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053919181

ABSTRACT:
In the semiconductor device according to the present invention, bonding pads are arranged on the periphery of the semiconductor chip and power supply inner leads are disposed inwardly of signal inner leads. Since bonding wires for connecting the signal lead to signal pads corresponding thereto do not extend astride of the power supply inner lead, a package of a semiconductor device can be thereby thinned as much as possible.

REFERENCES:
patent: 4595945 (1986-06-01), Graver
patent: 4937656 (1990-06-01), Kohara
patent: 4967261 (1990-10-01), Niki et al.
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5072280 (1991-12-01), Matsukura
patent: 5229639 (1993-07-01), Hansen et al.
patent: 5229846 (1993-07-01), Kozuka
patent: 5250840 (1993-10-01), Oh et al.
Nikkei Microdevices, Feb. 1991, pp. 89-97.

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