Semiconductor device

Details Semiconductor device Semiconductor device

1990-10-31

1992-04-07

Hille, Rolf

Electricity: electrical systems and devices

Miscellaneous

357 75, 357 68, H01L 2312, H01L 2314, H01L 2710

Patent

active

051032473

ABSTRACT:
In an SIP module of the type wherein memory ICs are mounted to both surfaces of a substrate, the present invention provides a face package type memory module wherein packaging is made in an inclined direction in place of vertical packaging of the prior art technique and only the memory ICs mounted to the upper surface side of the substrate are deviated to the positions closer to the end portion of the substrate in order to drastically reduce the packaging height.

REFERENCES:
patent: 4074342 (1978-02-01), Honn et al.
patent: 4616655 (1986-10-01), Weinberg et al.
patent: 4984064 (1991-01-01), Toshio et al.
"VLSI Device Handbook", published by K. K. Science Forum, No. 28, 1983, pp. 239-250.

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