Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent
1994-12-23
1996-10-29
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
257781, 257786, H01L 2348, H01L 2352, H01L 2940
Patent
active
055699642
ABSTRACT:
A semiconductor chip has a shape of a quadrangle. Bumps are arranged in a staggered fashion along at least one side of the semiconductor chip, and include first bumps and second bumps arranged inside the first bumps. If each of the first bumps has a maximum width Bw1 and each of the second bumps has a maximum width Bw2 in a direction parallel to at least one side of the semiconductor chip, Bw2>Bw1. If each of the first bumps has a maximum length Bd1 and each of the second bumps has a maximum length Bd2 in a direction perpendicular to at least one side of the semiconductor chip, Bd1>Bd2.
REFERENCES:
patent: 4866504 (1989-09-01), Landis
patent: 5173763 (1992-12-01), Cipolla et al.
patent: 5349238 (1994-09-01), Ohsawa et al.
European Search Report, dated Jun. 2, 1995.
IBM Technical Disclosure Bulletin, "Unique Pad Geometry For Optimum Solder Application," vol. 34, No. 1, Jun. 1991; pp. 465-466.
IBM Technical Disclosure Bulletin, "Novel Footprint Design For Tab Assembly," vol. 34, No. 10A, Mar. 1992; pp. 331-332.
Clark S. V.
Crane Sara W.
Kabushiki Kaisha Toshiba
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