Semiconductor device

Details Semiconductor device Semiconductor device

1995-12-07

1998-06-16

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257687, 257690, H01L 23495

Patent

active

057675686

ABSTRACT:
A highly reliable semiconductor device with an increased life is provided as comprising a wiring substrate comprising a portion for mounting a semiconductor pellet, a semiconductor pellet mounted on the portion for mounting the semiconductor pellet, an electrode provided on the wiring substrate connected to an electrode of the semiconductor pellet, a layer comprising a sealing material which seals the semiconductor pellet and the electrode provided on the wiring substrate, wherein at least a through hole for discharging water vapor is formed in the portion for mounting the semiconductor pellet provided on the wiring substrate, and the protective film for preventing the adhesion of solder or plating is removed from not only the soldered or plated portion but also the periphery of the portion for mounting the semiconductor pellet.

REFERENCES:
patent: 4814943 (1989-03-01), Okuaki
patent: 4866506 (1989-09-01), Nambu et al.

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