Semiconductor device

Details Semiconductor device Semiconductor device

1999-06-03

2000-11-28

Graybill, David E.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257685, 257706, 257713, 257724, 257725, 257782, 257784, 257787, H01L 23495, H01L 2302, H01L 2310, H01L 2334, H01L 2328

Patent

active

061539260

ABSTRACT:
A semiconductor device that be able to be manufactured in same equipment dose not depend on a number of semiconductor chips which are mounted on the semiconductor device.
The semiconductor device can be prepared by a method comprising a step of mounting a semiconductor chip 2 having a first electrode and a second electrode on both sides on a common substrate 20 having N chip areas 8 having a first wiring area 9a and a second wiring area 9a insulated from the first wiring area 9a and separating areas 7 separating adjacent chip areas 8, a step of connecting the first wiring area 9a and first electrode, a step of mounting semiconductor chips 2 on the chip mounting areas 8 of the common substrate 9, a step of connecting the second wiring area 9b and the second electrode of semiconductor chip 2 electrically, and a step of removing extra area 8b which is chip area 8 having no semiconductor chip 2.

REFERENCES:
patent: 5859387 (1999-01-01), Gagnon
patent: 6069401 (2000-05-01), Nakamura et al.
patent: 6084780 (2000-07-01), Happoya

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