Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Mesa structure

Patent

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Details

257621, 257773, 257774, H01L 2947

Patent

active

059145277

ABSTRACT:
The present invention is directed to a semiconductor device and method wherein a vertical opening is provided or formed completely through a semiconductor substrate of the semiconductor device to print an external electrical contact to be made to one of the semiconductor regions of the semiconductor substrate. In the disclosed embodiment an electrical contact is also provided to the bottom portion of the semiconductor substrate.

REFERENCES:
patent: 5357123 (1994-10-01), Sugawara

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