Semiconductor device

Details Semiconductor device Semiconductor device

1995-09-20

1998-03-10

Fahmy, Wael

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257691, 257692, H01L 23495

Patent

active

057264902

ABSTRACT:
A leadframe assembly is used in which a ground metal plane (1) having a ground external lead (2), an annular insulating tape (4), a power supply metal plane (5) having a power supply external lead (6), an annular insulating tape (4') and a leadframe (7) having signalling internal and external leads (8, 9) with the ground and power supply external leads removed are sequentially laminated from below. Since each metal plane is provided with a resin sealing dam bar (3) of the same form as that of the leadframe (7), they can be sealed with resin together, and then the resin sealing dam bar (3) is removed and the leads (2, 6, 9) are formed to complete the semiconductor device. Thus, the process for joining the metal planes to the ground and power supply external leads becomes unnecessary, and an inexpensive semiconductor device can be realized.

REFERENCES:
U.S. application No. 07/002,144, Mallik et al., filed Jan. 12, 1987.

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