1987-08-11
1990-04-03
Hille, Rolf
357 68, H01L 2352, H01L 2160
Patent
active
049145037
ABSTRACT:
A semiconductor device comprises a semiconductor chip having main power supply lines which are arranged in peripheral regions in the vicinity of edges of the semiconductor chip and which are formed with multi-level metallization. The main power supply lines are formed with arrangements in that layers of the same potential face each other through an insulating layer in chip corner regions adjacent to corners of the semiconductor chip.
REFERENCES:
patent: 4500906 (1985-02-01), Ohno et al.
patent: 4511914 (1985-04-01), Remedi et al.
patent: 4628343 (1986-12-01), Komatsu
patent: 4654689 (1987-03-01), Fujii
patent: 4809046 (1989-02-01), Aoyama et al.
Shirato Takehide
Tazunoki Teruo
Clark S. V.
Fujitsu Limited
Hille Rolf
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