Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent
1999-05-28
2000-08-29
Hardy, David
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
257678, 257687, 257737, 257779, 257780, 257786, H01L 2302
Patent
active
061113093
ABSTRACT:
A semiconductor device has a semiconductor chip including an external pad, a first substrate supporting the semiconductor chip on the first side, recesses arranged in matrix form on the second side, solder plugs filled in the recesses, and interconnections that connect the pads of the semiconductor chip to the solder plugs, being sealed by a molded resin body, and a second substrate provided with a solder paste on the first side. Recesses are made on the second side of the first substrate in matrix form and solder plugs are filled in the recesses as electrode pads for mounting. In the surface of the solder plugs trenches are made to form a lattice in plane view. The aspect ratio of the trench is large enough so that the molten solder paste is transferred deep into the recesses before the solder plugs are melted in mounting process.
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patent: 5670826 (1997-09-01), Bessho et al.
patent: 5869886 (1999-02-01), Tokuno
patent: 5874784 (1999-02-01), Aoki et al.
patent: 5894167 (1999-04-01), Moden et al.
"Neutralization of Open Base Leakage", H.H. Nick, vol. 11 No. 10, Mar. 1969 .
Hardy David
Kabushiki Kaisha Toshiba
Ortiz Edgardo
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