Semiconductor device

Details Semiconductor device Semiconductor device

1992-12-14

1994-10-25

Thomas, Tom

Fishing, trapping, and vermin destroying

437211, 437214, 437215, 437217, H01L 2160

Patent

active

053589041

ABSTRACT:
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

REFERENCES:
patent: 3783348 (1974-01-01), Swartz et al.
patent: 4203792 (1980-05-01), Thompson
patent: 4209355 (1980-06-01), Burns
patent: 4355463 (1982-10-01), Burns
patent: 4637130 (1987-01-01), Fujii et al.
patent: 4661837 (1987-04-01), Sono
patent: 4684975 (1987-08-01), Takiar et al.
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4807018 (1989-02-01), Cellai
patent: 4809053 (1989-02-01), Kuraishi
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4996587 (1991-02-01), Hinrischsmeyer et al.
patent: 5068712 (1991-11-01), Murakami et al.
"Thin Small Outline Packages", IBM TDB, vol. 34, No. 1, Jun., 1991, pp. 358-359.

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