1987-09-04
1989-08-15
Hille, Rolf
357 72, 357 68, H01L 2314, H01L 2318, H01L 2332
Patent
active
048579890
ABSTRACT:
A semiconductor element mounting member which is a mounting portion of a lead frame is provided with a concave portion having a smaller area than that of the lower surface of a semiconductor element, the area being less than 4.times.4 mm.sup.2. The concave portion is filled with a bonding material, and the semiconductor element and the semiconductor element mounting member are bonded by the bonding material.
REFERENCES:
patent: 4589010 (1986-05-01), Tateno et al.
patent: 4712129 (1987-12-01), Orcutt
Banjo Toshinobu
Fukudome Katsuyuki
Mori Ryuichiro
Clark S. V.
Hille Rolf
Mitsubishi Denki & Kabushiki Kaisha
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