Semiconductor device

Details Semiconductor device Semiconductor device

1988-05-17

1991-02-19

Hille, Rolf

357 75, H01L 2302, H01L 2312

Patent

active

049948962

ABSTRACT:
Two types of semiconductor packages (6a, 6b), being different in direction of bending of external lead terminals (3) from each other, are prepared to be mounted on a single surface or both surfaces of a package substrate. In case of single-surface mounting, the external lead terminals (3) of the same pin numbers can be electrically connected with each other by drawing around wires (9). In case of double-surface mounting, the external lead terminals (3) of the same pin numbers can be electrically connected with each other by through holes.

REFERENCES:
patent: 4482781 (1984-11-01), Burns
patent: 4651192 (1987-03-01), Matsushita et al.
patent: 4682207 (1987-07-01), Akasaki et al.
patent: 4771366 (1988-09-01), Blake et al.
Iafrate, "High Density and Speed Performance Chip Joining Procedure and Package", IBM Tech. Disclosure Bulletin, vol. 15, No. 4, 9/72, p. 1281.

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