Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1997-07-21
1999-02-02
Kincaid, Kristine
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
174 524, H01L 2352
Patent
active
058669400
ABSTRACT:
In order to reduce the chip size of a semiconductor device as well as to separate noises between at least two types of pads having different functions, at least one Vcc and at least one Vss are provided on opposite edges of a package (101) so that output pins or I/O pins are arranged therebetween and input pins are arranged outside the same. Non-connected excess pins (NC) are arranged on upper and lower boundaries, for omitting wires and reducing the chip size.
REFERENCES:
patent: 5165067 (1992-11-01), Wakefield et al.
patent: 5287000 (1994-02-01), Takahashi et al.
patent: 5331201 (1994-07-01), Nishino
patent: 5394008 (1995-02-01), Ito et al.
patent: 5410173 (1995-04-01), Kikushima et al.
patent: 5428247 (1995-06-01), Sohn et al.
patent: 5442233 (1995-08-01), Anjoh et al.
Dang-hsing Yiu Tom
Hikawa Tetsuo
Ni Ful-Long
Sawada Takashi
Takata Akira
Dang-hsing Yiu Tom
Kincaid Kristine
Mega Chips Corporation
Ngo Hung V
LandOfFree
Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1120039