Semiconductor device

Details Semiconductor device Semiconductor device

1989-11-28

1992-01-21

Gensler, Paul

357 71, 357 74, H01L 2348

Patent

active

050831917

ABSTRACT:
A semiconductor device includes an insulating film having an opening and first and second surfaces, a semiconductor chip positioned inside the opening and having first and second surfaces and a plurality of electrodes formed on its first surface, a plurality of leads supported on the first surface of the insulation film and connected to the electrodes of the semiconductor chip, first and second protective films facing the first and second surfaces of the insulating film, respectively, and a bonding agent disposed between the first and second protective films sealing the semiconductor chip and bonding the films together.

REFERENCES:
patent: 4701781 (1987-10-01), Sankhagowit
patent: 4772936 (1988-09-01), Reding et al.

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