Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Reexamination Certificate
2008-10-17
2011-10-04
Fourson, III, George (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Beam leads
C257S773000, C257SE23034, C257SE23078
Reexamination Certificate
active
08030766
ABSTRACT:
A semiconductor device that can cope with larger numbers of pins and finer pitches while suppressing lowering of the manufacturing yield and reliability includes: a semiconductor chip having a plurality of electrodes provided on an upper surface thereof; a plurality of lead terminals including inner lead portions disposed toward the semiconductor chip; a sheet-form wiring member having a plurality of conductors insulated from one another on one main surface thereof; and a sealing-resin layer for sealing at least the semiconductor chip, the inner lead portions and the wiring member. The electrodes of the semiconductor device and the inner lead portions of the lead terminals are electrically connected respectively to each other via the conductors of the wiring member.
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Fish & Richardson P.C.
Fourson, III George
Rohm & Co., Ltd.
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