Semiconductor device

Details Semiconductor device Semiconductor device

1992-09-11

1993-09-21

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165185, 257718, 257726, 257727, 361383, 361388, 361690, 361707, 174 163, H05K 720

Patent

active

052474259

ABSTRACT:
A container type semiconductor device containing many semiconductor elements is provided. The device allows heat to be dissipated from both sides of each semiconductor element by placing metal contact plates against the emitter electrodes of each semiconductor element. The metal contact plates are held firmly in place by spring means which also make contact with inner face of a terminal which is exposed outside the container. Heat flows from each semiconductor element through the spring means to the external terminal where the heat is dissipated. In one embodiment, the spring means are used also as a path for the flow of current to the terminal. Because wiring is not used, inductance is low making the device suitable for high frequency applications.

REFERENCES:
patent: 3401317 (1968-09-01), Gault
patent: 3717797 (1973-02-01), Rydeski
patent: 3864607 (1975-02-01), Phillips
patent: 3993123 (1976-11-01), Chu et al.
patent: 4769744 (1988-09-01), Neugebauer et al.

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