Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2009-04-21
2011-11-01
Semenenko, Yuriy (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C174S260000, C174S262000, C174S256000, C361S767000
Reexamination Certificate
active
08050049
ABSTRACT:
The present invention provides a semiconductor device of a double-side mounting structure including a circuit board and a plurality of semiconductor chips arranged and joined together on the opposite surfaces of the circuit board, wherein in an area in which the semiconductor chip31mounted on the top surface of the circuit board2overlaps with the semiconductor chip32mounted on the bottom surface of the circuit board2, a recess portion21(or a protruding portion22) is formed in the surfaces of the circuit board2.
REFERENCES:
Publication No. 2002-237503 Application No. 2001-031910 Application Date : Aug. 23, 2020.
Iwase Teppei
Kumazawa Kentaro
Nakamura Koujiro
Nobori Kazuhiro
Tomura Yoshihiro
Aychillhum Andargie M
Panasonic Corporation
Semenenko Yuriy
Steptoe & Johnson LLP
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